Презентация Placement and routing guidelines for Power Electronics Devices онлайн
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Слайды и текст к этой презентации:
№1 слайд
Содержание слайда: Placement and routing guidelines for Power Electronics Devices
Printed Circuit Board Design for Power Electronics: A Practical Guide
Dr. Oleksandr Velihorskyi, PhD
№2 слайд
Содержание слайда: Lecture plan
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№3 слайд
Содержание слайда: Current position: 1/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№4 слайд
Содержание слайда: PCB design for PE devices. Why is it so important?
Improper PCB design leads to:
"unstable" switching waveforms and jittering,
audible noise from the magnetic components,
ringing, crosstalk, ground bounce,
PCB design can lead good scheme to fail.
but even best PCB design can’t improve bad schematic solution.
№5 слайд
Содержание слайда: Planning the layout.
Each PE device contains power part and control scheme.
Power part - DC/DC, DC/AC, AC/AC.
Control - measure parameters and generate signals.
Type of signals in the PE devices:
analog – measured values (control) - victims,
digital – control signals, interface with the environment (PC, memory, etc.) – aggressors/victims,
power – DC or AC, sine, pulse - aggressors.
№6 слайд
Содержание слайда: Planning the layout.
Do we need to separate power and control on to two different PCB’s?
device characteristics?
EMC?
accuracy?
maintainability?
cost?
reliability?
№7 слайд
Содержание слайда: Planning the layout.
№8 слайд
Содержание слайда: Current position: 2/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№9 слайд
Содержание слайда: Single-board PCB layout.
Power part location should be done at the first stage of PCB layout.
“Rooms” in CAD like Altium Designer can significantly improve PCB layout efficiency.
Power part is a one of the most complex part of the PE device.
№10 слайд
Содержание слайда: Single-board PCB layout.
Typical PCB layout of the single-board PE device.
№11 слайд
Содержание слайда: Single-board PCB layout.
High speed components (both analog and digital) need to be placed as close as possible to external connectors (if required)!
Analog and digital signals in an ideal case should never run parallel to each other at a small distance!
№12 слайд
Содержание слайда: Current position: 3/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№13 слайд
Содержание слайда: Stack of layers – 1, 2 or more?
1-layer PCB:
Most sensitive to crosstalk and another EMI.
Need to use Jumpers.
2-layer PCB:
Better than 1-layer – more space for traces/components.
More resistant to EMI.
Plane layers are possible, but not fully realizable.
BGA components is not eligible.
№14 слайд
Содержание слайда: Stack of layers – 1, 2 or more?
Multi-layer PCB:
Better than 2-layer – more space for traces.
Best resistance to EMI (around +20dB compared to
2-layer).
Plane layers are fully realizable.
All type of components are eligible.
Additional cost and design time.
№15 слайд
Содержание слайда: Stack of layers – 1, 2 or more?
Conclusion:
1-layer PCBs – exceptional cases.
2-layer PCBs – in case of cost-limited projects.
Multi-layer PCBs – in typical high-performance cases.
№16 слайд
Содержание слайда: Desirable stack of layers
Typical stack of 4-layers PCB
№17 слайд
Содержание слайда: Desirable stack of layers
Typical stack of 6-layers PCB
№18 слайд
Содержание слайда: Current position: 4/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№19 слайд
Содержание слайда: Important features of power part
Highest currents and voltages in the device
What ever – mA and V or A and kV.
Traces width and clearances should be wide enough!
Large current pulses with sharp edges.
Sharp edges leads to electromagnetic interference (EMI).
PCB designer must pay attention to the each switching circuits in PE device – identify, place components and properly route traces!
№20 слайд
Содержание слайда: Buck Converter
№21 слайд
Содержание слайда: Current loops ordered by EMI generation in power conv.
1. Power switch loop – maximum attention!
2. Rectifier loop – maximum attention!
3. Input source loop.
4. Output load loop.
№22 слайд
Содержание слайда: Boost converter
№23 слайд
Содержание слайда: Transformer Isolated Flyback Converter
№24 слайд
Содержание слайда: The first rule for PE devices PCB design.
1. The pulse loop circumference must be as short as possible.
traces with pulsating current must be as short and wide as possible.
Results:
Trace resistance and inductance improvement.
EMI improvement (ΔU=L·di/dt).
Efficiency improvement (Ptrace=I2R).
№25 слайд
Содержание слайда: PCB layout for buck converter.
Red – power switch loop, blue – rectifier loop.
№26 слайд
Содержание слайда: Output Rectifier Loop in Flyback Converter
Red – rectifier loop, black – load loop.
№27 слайд
Содержание слайда: Parallel C Filter Layout
№28 слайд
Содержание слайда: Parallel C Filter Layout
PCB layout between each capacitor and source in multi-component filter must be as identical as possible!
Non-identical layout will lead to different current sharing and will reduce capacitor lifespan (mean time between failures, MTBF).
№29 слайд
Содержание слайда: Current position: 5/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№30 слайд
Содержание слайда: Grounding in the PE devices.
Types of ground in power convertor devices:
Power ground with high current (DC, AC and pulse).
Signal ground in controller and feedback part.
Analog ground for feedback.
Digital ground for controller (MCU, DSP or FPGA device).
Main rule: “separate ground for high-current and signal part”!
№31 слайд
Содержание слайда: Grounding in buck converter
Red – control ground, blue – power ground.
№32 слайд
Содержание слайда: Control and power ground connection.
Rules of thumb for grounding in PE devices:
Feedback ground must be connected with power ground near the negative pin of output capacitor.
If control IC has separated (power and control) ground, these pins must be routed separately and connected to the current sensing resistor that measure power switch current.
№33 слайд
Содержание слайда: Grounding in flyback converter
№34 слайд
Содержание слайда: Current position: 6/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№35 слайд
Содержание слайда: Current sensor resistor PCB layout consideration
The best characteristic provides 4-wire Kelvin sensing.
Example of using 2-wire resistors as 4-wire Kelvin
№36 слайд
Содержание слайда: Current sensor resistor PCB layout consideration
Sensing trace should be placed on opposite layer and connect to pad by using vias.
Example of measurement for different connection types (by Analog Devices paper* data):
№37 слайд
Содержание слайда: Land Patterns for SMD components in PE devices
For minimization of ESL and ESR Pad configuration for SMD components must be:
Without thermal connection.
With vias as close as possible to pad.
With sufficient number of vias in case of changing layer near the pad.
Notice:
SMD pad without thermal relief could cause soldering problem!
№38 слайд
Содержание слайда: Land Patterns for SMD components in PE devices
Examples of Pad configuration:
№39 слайд
Содержание слайда: Current position: 7/7
Planning the layout.
Single-board PCB layout.
Placement of Layers for PE devices.
Current loops in Power Electronics Devices.
Grounding in the PE devices.
Land Patterns for SMD components in PE devices.
Control scheme layout consideration.
№40 слайд
Содержание слайда: Mixed-signal grounding
Mixed-signal components:
External DAC and ADC, MCU with DAC/ADC on board.
Ground in mixed-signal components – the main question:
Digital?
Analog?
Some pins – digital, another ones – analog?
№41 слайд
Содержание слайда: Mixed-signal grounding
Mixed-signal components:
External DAC and ADC, MCU with DAC/ADC on board.
Ground in mixed-signal components – the main question:
Digital?
Analog?
Some pins – digital, another ones – analog?
№42 слайд
Содержание слайда: Digital and Analog Ground
Bed design:
Digital (“dirty”) and analog (“clean”) ground are common – AGND bouncing.
№43 слайд
Содержание слайда: Digital and Analog Ground
Good design:
Digital and analog ground are separated.
№44 слайд
Содержание слайда: Digital and Analog Ground
Planes for ground in control circuits of power electronic devices should improve EMC of control circuit.
4-layer PCB (sig - VCC– GND - sig) is a typical solution for the control board.
VCC and GND planes provide additional distributed capacitance for control board power supply.
№45 слайд
Содержание слайда: Mixed-signal grounding –
single PCB
“Star” grounding in the control part of single-board PE device – Analog Device advice.
№46 слайд
Содержание слайда: Mixed-signal grounding –
single PCB
“Star” grounding in the control part f single-board PE device – Linear Technology AppNote.
№47 слайд
Содержание слайда: Mixed-signal grounding –
multi-board PCB
Grounding techniques for single-board PE devices are not optimum for multi-board devices.
Multi-board grounding techniques are depend on
Low digital currents.
High digital currents.
Provide additional ground pin in the connectors.
Recommend allocate 30-40% connector pins to GND.
Separate digital and analog signals by ground pins.
№48 слайд
Содержание слайда: Mixed-signal grounding
Small digital currents:
№49 слайд
Содержание слайда: Mixed-signal grounding
Small digital currents:
№50 слайд
Содержание слайда: Mixed-signal grounding
High digital currents:
№51 слайд
Содержание слайда: Bypass Capacitors
Noise on power line caused by switching digital components is shunted through the bypass capacitor, reducing the effect it has on the rest of the circuit.
№52 слайд
Содержание слайда: Bypass Capacitors
Bypass capacitor should be connected to the power pins of the digital components as close as possible!
№53 слайд
Содержание слайда: Oscillator Layout Consideration
Oscillator Circuit in common has the Highest operation frequency in whole design.
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